idw – Informationsdienst Wissenschaft
Nachrichten, Termine, Experten
Nachrichten, Termine, Experten
At this year’s OFC Fraunhofer HHI presents the latest developments in Photonic Networks, Systems and Components at Fraunhofer Booth 2219, March 19-23, Los Angeles, USA.
You find the following highlights at the Fraunhofer booth 2219:
Generic InP Foundry Platform: One InP technology to cover a vast variety of monolithic or hybrid integration solutions
Fraunhofer HHI fabricates individual photonic integrated circuits. Fraunhofer HHI offers an InP platform that integrates receivers (40GHz), transmitters (20GHz) and (1dB/cm) passive components. Partners offer services for design work and packaging.
Hybrid PICs
Fraunhofer HHI’s hybrid integration platform PolyBoard allows for rapid prototyping, short iteration cycles and low upfront development effort. The technology allows the integration of on-chip free space elements, 3D structures, graphene-based electro-absorption modulators, as well as other optical functionalities such as switches, variable optical attenuators, tunable lasers, and flexible high frequency and optical interconnects. The services of Fraunhofer HHI include simulation, CAD, technology development, device manufacturing, characterization, and qualification.
Hybrid Optical Wireless/60GHz Link
The robust, hybrid LED Link with parallel 60 GHz transmission is well suited for mobile backhauling with low latency and high availability. The technology is also suitable for wireless point-to-point communication in industrial environments.
High-Speed Real-Time Digital Signal Processing Platform
The highly flexible FPGA-based development and demonstration platform is suitable for signal processing algorithms and real-time data transmission. The platform includes 65GSa/s DACs, 56GSa/s ADCs, 100GbE-class optical interfaces and Virtex Ultrascale/Ultrascale+ FPGA processing capabilities in a robust, 19’’-housing.
https://www.hhi.fraunhofer.de/en/press-media/press-releases.html
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