Printed Electronics with printed diagnostics and 3D-printing will open a complete toolset for wide range of future applications and solutions. These technologies are the key elements to be integrated in the manufacturing process when, for example, huge volumes of disposable point-of-care tests are produced.
All these variants offer vast possibilities for new products, since printed electronics are highly scalable and form factors can match nearly any need imaginable.
The event ΣYSTEMS INTEGRATION, initiated by the IVAM Microtechnology Network, will take place in Finland for the first time. Since 2008, the successful event series has been providing the opportunity for manufacturers and users to exchange ideas about intelligent applications of microtechnological solutions.
Several company visits will be organized on June 9, 2015.
On June 10, 2015 the established symposium will focus on “Printed Electronics, Printed Diagnostics and 3-D-Printing“ and is organized in cooperation with VTT Technical Research Centre of Finland. The presentations will be held in English.
VTT Technical Research Centre of Finland will be host of the event on June 10, 2015 in Oulu/Finland. VTT develops micro- and nanoelectronics, MEMS-technology, photonics and electronics packaging. Expertise covers CMOS-compatible MEMS process, SOI technology, micro- and nanophotonics. VTT has expertise in hermetic encapsulation, polymer and ceramic 3D and wafer scale packaging. VTT develops R2R electronics and optics printing.
Information on participating / attending:
The conference fee is 499,00 € if you register until April 24, 2015. The fee for registrations that reach us later is 549,00 €. This conference fee contains digital conference materials, drinks and snacks (dinner not included) and an administration fee.
Date:
06/09/2015 10:00 - 06/10/2015 18:00
Registration deadline:
06/06/2015
Event venue:
VTT Technical Research
Centre of Finland
Kaitoväylä 1
90571 OULU
Finland
90571 Oulu
Finland
Target group:
Business and commerce, Scientists and scholars
Email address:
Relevance:
international
Subject areas:
Electrical engineering, Information technology, Materials sciences
Types of events:
Conference / symposium / (annual) conference
Entry:
04/29/2015
Sender/author:
Mona Okroy-Hellweg
Department:
Presse- und Öffentlichkeitsarbeit
Event is free:
no
Language of the text:
English
URL of this event: http://idw-online.de/en/event50776
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