idw – Informationsdienst Wissenschaft
Nachrichten, Termine, Experten
Nachrichten, Termine, Experten
The backbone of our digital world is already made of glass: A network of optical fibers spans the globe and lets data cross our globe. We also experience the digital world through a pane of glass: We interact with the online world every day through the glass display of our smartphones.
For almost 20 years, Fraunhofer IZM has been working on giving glass an even greater role in data transmission. But even today, copper is used when data has to be transmitted over short distances in the centimeter range, for example on printed circuit boards. In order to use optical signals for these short distances just as they are used in longer-distance fiber optic cables, Fraunhofer IZM invented the electrical optical circuit board (EOCB). And in close cooperation with research and industry partners, a complete process was developed to manufacture EOCBs and glass based interposer from glass. This technology gain more and more interest for co-packaging in data center modules of next generation.
Glass is more rigid and can handle more chips on a package than organic substrates including integrated optical interconnects. Our concept enjoy all the benefits that optical signals have over electrical transmission. In addition, glass-based EOCBs and interposer also have all the advantages of glass as a material: very good dielectric properties - especially for high-frequency applications - as well as great dimensional stability, biocompatibility, and high chemical resistance. The thermal management can be in-designed.
What to expect from our online sessions:
In our 45-minutes expert sessions we would like to present to you trending topics in a technical presentation. Afterwards, our experts will be available for your questions and comments and a joint discussion. New topics and dates for this workshop series will be published regularly on this webpage.
More information and registration (free of charge!) you ca find on our website:
https://www.izm.fraunhofer.de/en/news_events/trainings-and-workshops/materials-f...
Next dates & topics:
07.11.: Structured glass for electronic and photonic packaging (Dr. Henning Schröder)
21.11.: New Material in Semiconductor Industry – Challenges for sustainable production (Catharina Rudolph)
05.12.: Recycled Plastics in Electronics: Challenges & Opportunities (Theresa Marie Aigner & Ronja Scholz)
Information on participating / attending:
Participation is free of charge, registration is required. This workshop series aims to address our customers, partners and interested parties from industry, politics and science.
Date:
11/07/2023 16:00 - 11/07/2023 16:45
Event venue:
MS Teams I Online
13355 Berlin
Berlin
Germany
Target group:
Business and commerce, Scientists and scholars
Email address:
Relevance:
transregional, national
Subject areas:
Electrical engineering
Types of events:
Seminar / workshop / discussion
Entry:
10/25/2023
Sender/author:
Susann Thoma
Department:
Presse- und Öffentlichkeitsarbeit
Event is free:
yes
Language of the text:
English
URL of this event: http://idw-online.de/en/event75535
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