idw – Informationsdienst Wissenschaft

Nachrichten, Termine, Experten

Grafik: idw-Logo
Grafik: idw-Logo

idw - Informationsdienst
Wissenschaft

Science Video Project
idw-Abo

idw-News App:

AppStore

Google Play Store

Event


institutionlogo

03/12/2024 - 03/12/2024 | Berlin

Novel Integration Concepts for Power Electronics – PCB Embedding for SiC and GaN Semiconductors

4# session of series »Powering the Future - Technologies for Power Electronics Modules with SiC and GaN Semiconductors« (Speaker: Lars Böttcher)

The expert session will give an insight into the concept of embedding and most recent developments for power electronics packages and modules. To address the integration of the required driver circuits and controllers, the idea of modularization such electronics systems will also be introduced.

Power modules equipped with wide band gap semiconductors like SiC and GaN are attracting increasing attention, due to the superior functionality of these materials. Especially for automotive, aerospace and energy grid applications, a large market potential is expected. Today’s power electronics modules typically consist of a ceramic substrate (DBC or AMB), carrying the power semiconductors, which are soldered and wire bonded for interconnection. Driver circuits and controllers have to be mounted to a separate substrate, which has to be connected to the DBC/AMB by wires or pins. The mechanical integration of the whole system requires a bulky housing. The electrical performance for devices with the potential for fast switching are limited by these module concepts and it’s interconnections.

Major aims in system optimization are the reduction of DC voltage link inductance, optimization of heat dissipation and an overall miniaturization and robustness of modules. Consequently, the shortening of interconnect length, the integration of thermal dissipation structures and a compact three-dimensional build-up of systems are of highest interest.

Embedding of SiC or GaN allows a significant size reduction, improved electrical and thermal performance and a high degree of reliability of such modules.

For the embedding of SiC bare dies, the dies are assembled to a suitable substrate by Ag sintering. Printed circuit board technologies are used to embed the devices into a polymer matrix by multilayer vacuum lamination, using epoxy prepreg material. Direct copper connections to the embedded SiC die are realized by laser via formation and electrolytic copper plating. Thick copper technologies could be implemented if needed for high currents and thermal management. If required, multiple wiring layers can be created, using PCB manufacturing processes.

The session will give a general overview about innovative power module technologies and will explain the embedding of power semiconductors in detail. Here it will address all most relevant points, like the demands on the semiconductor, the thermal and electrical considerations as well as the demands on the used materials. The technology approach will be described in detail and different module examples will be introduced and discussed.

What to expect from our Experts Sessions
In our 45-minutes expert sessions we would like to present to you trending topics in a technical presentation. Afterwards, our experts will be available for your questions and comments and a joint discussion.

Last Date & Topic:
26.3.2024 Reliability Challenges of Power Electronic Modules (Dr. Stefan Wagner)

More information, recordings of the previous sessions and registration (free of charge!) you can find on our website:
https://www.izm.fraunhofer.de/en/news_events/trainings-and-workshops/powering-th...

Information on participating / attending:
Participation is free of charge, registration is required. This workshop series aims to address our customers, partners and interested parties from industry, politics and science.

Date:

03/12/2024 16:00 - 03/12/2024 16:45

Event venue:

MS Teams I Online
13355 Berlin
Berlin
Germany

Target group:

Business and commerce, Scientists and scholars

Relevance:

transregional, national

Subject areas:

Electrical engineering, Traffic / transport

Types of events:

Seminar / workshop / discussion

Entry:

02/23/2024

Sender/author:

Susann Thoma

Department:

Presse- und Öffentlichkeitsarbeit

Event is free:

yes

Language of the text:

English

URL of this event: http://idw-online.de/en/event76350

Attachment
attachment icon Eventinformation

Help

Search / advanced search of the idw archives
Combination of search terms

You can combine search terms with and, or and/or not, e.g. Philo not logy.

Brackets

You can use brackets to separate combinations from each other, e.g. (Philo not logy) or (Psycho and logy).

Phrases

Coherent groups of words will be located as complete phrases if you put them into quotation marks, e.g. “Federal Republic of Germany”.

Selection criteria

You can also use the advanced search without entering search terms. It will then follow the criteria you have selected (e.g. country or subject area).

If you have not selected any criteria in a given category, the entire category will be searched (e.g. all subject areas or all countries).