idw – Informationsdienst Wissenschaft
Nachrichten, Termine, Experten
Nachrichten, Termine, Experten
Power modules equipped with wide band gap semiconductors like SiC and GaN are attracting increasing attention, due to the superior functionality of these materials. Especially for automotive, aerospace and energy grid applications, a large market potential is expected. Today’s power electronics modules typically consist of a ceramic substrate (DBC or AMB), carrying the power semiconductors, which are soldered and wire bonded for interconnection. Driver circuits and controllers have to be mounted to a separate substrate, which has to be connected to the DBC/AMB by wires or pins. The mechanical integration of the whole system requires a bulky housing. The electrical performance for devices with the potential for fast switching are limited by these module concepts and it’s interconnections.
Major aims in system optimization are the reduction of DC voltage link inductance, optimization of heat dissipation and an overall miniaturization and robustness of modules. Consequently, the shortening of interconnect length, the integration of thermal dissipation structures and a compact three-dimensional build-up of systems are of highest interest.
Embedding of SiC or GaN allows a significant size reduction, improved electrical and thermal performance and a high degree of reliability of such modules.
For the embedding of SiC bare dies, the dies are assembled to a suitable substrate by Ag sintering. Printed circuit board technologies are used to embed the devices into a polymer matrix by multilayer vacuum lamination, using epoxy prepreg material. Direct copper connections to the embedded SiC die are realized by laser via formation and electrolytic copper plating. Thick copper technologies could be implemented if needed for high currents and thermal management. If required, multiple wiring layers can be created, using PCB manufacturing processes.
The session will give a general overview about innovative power module technologies and will explain the embedding of power semiconductors in detail. Here it will address all most relevant points, like the demands on the semiconductor, the thermal and electrical considerations as well as the demands on the used materials. The technology approach will be described in detail and different module examples will be introduced and discussed.
What to expect from our Experts Sessions
In our 45-minutes expert sessions we would like to present to you trending topics in a technical presentation. Afterwards, our experts will be available for your questions and comments and a joint discussion.
Last Date & Topic:
26.3.2024 Reliability Challenges of Power Electronic Modules (Dr. Stefan Wagner)
More information, recordings of the previous sessions and registration (free of charge!) you can find on our website:
https://www.izm.fraunhofer.de/en/news_events/trainings-and-workshops/powering-th...
Hinweise zur Teilnahme:
Participation is free of charge, registration is required. This workshop series aims to address our customers, partners and interested parties from industry, politics and science.
Termin:
12.03.2024 16:00 - 16:45
Veranstaltungsort:
MS Teams I Online
13355 Berlin
Berlin
Deutschland
Zielgruppe:
Wirtschaftsvertreter, Wissenschaftler
E-Mail-Adresse:
Relevanz:
überregional
Sachgebiete:
Elektrotechnik, Verkehr / Transport
Arten:
Seminar / Workshop / Diskussion
Eintrag:
23.02.2024
Absender:
Susann Thoma
Abteilung:
Presse- und Öffentlichkeitsarbeit
Veranstaltung ist kostenlos:
ja
Textsprache:
Englisch
URL dieser Veranstaltung: http://idw-online.de/de/event76350
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Die Erweiterte Suche können Sie auch nutzen, ohne Suchbegriffe einzugeben. Sie orientiert sich dann an den Kriterien, die Sie ausgewählt haben (z. B. nach dem Land oder dem Sachgebiet).
Haben Sie in einer Kategorie kein Kriterium ausgewählt, wird die gesamte Kategorie durchsucht (z.B. alle Sachgebiete oder alle Länder).
