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10/29/2001 - 10/30/2001 | Berlin

Workshop "Flexible Chips: FLIP CHIP & CSP"

Theoretical and especially practical knowledge of flip chip technology is presented during this two day workshop. The Fraunhofer IZM together with its partner SIEMENS PL has established a demonstration center for the assembly of flip chips (FC) and chip size packages (CSP).

Information on participating / attending:
In deutscher Sprache.
Kontakt: Nancy Kruse
Telefon: 0 30/4 64 03-1 55

Date:

10/29/2001 09:00 - 10/30/2001

Event venue:

Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
Gustav-Meyer-Allee 25, Geb. 17, Aufg.2
13355 Berlin
Berlin
Germany

Target group:

Business and commerce, Scientists and scholars

Email address:

Relevance:

transregional, national

Subject areas:

Information technology, Materials sciences, Mechanical engineering

Types of events:

Entry:

10/05/2001

Sender/author:

Dr. Johannes Ehrlenspiel

Department:

Kommunikation

Event is free:

unknown

Language of the text:

German

URL of this event: http://idw-online.de/en/event4676


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