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02/03/2021 - 02/03/2021 | Berlin

#2 Online-Session »IZM Photonics: IN GLASS WE TRUST«

Integrated glass-based electro-optical platform for co-packaging

Latest trends in system integration and packaging are strongly aiming at heterogeneous, hybrid integration solutions such as co-packaging of electronics and optics and disaggregated system on-chip. In this webinar we will present a glass-based platform suitable for these integration strategies and show how our approach allows for a cost reduction compared to other material platforms.

After our great sucess of the first online session we´re happy to announce the second session of »IZM Photonics: IN GLASS WE TRUST«.

Be part of our second lecture session on February 2nd, 2021: Within 45 minutes we would like to show you one presentation - partly including demonstrations - and afterwards our experts will be available in a deep dive for your questions and comments. Participation is free of charge, registration is required.

https://cms.mcc-events.de/izm/events/integrated-glass-based-electro-optical-plat...

In our expert-sessions we would like to show what is possible with glass in the field of photonic packaging and how you can still use the possibilities for your industry or for us together in joint projects. Due to the corona pandemic, we have been looking for a virtual space to get in conversation on this subject to each other and would like to create a public network framework with you.

At Fraunhofer IZM, photonics stands for the integration of optoelectronics and microoptics with the aim of miniaturizing, increasing efficiency and enhancing the functionality of systems for communication and sensor technology. The special thing about it is the material glass - an all-rounder in research. Big Data with the help of glass, circuit boards and optical chips made of glass and much more. In the online workshop series IZM Photonics: In glass we trust, we would like to discuss with you the possibilities that the transparent, amorphous material still offers for packaging and interconnection technology and its areas of application.

Information on participating / attending:
Participation is free of charge, registration is required.

Invitations are extended primarily to customers and partners, but also to interested parties from industry, politics, science and society.

Date:

02/03/2021 16:30 - 02/03/2021 17:15

Registration deadline:

02/03/2021

Event venue:

Online
13355 Berlin
Berlin
Germany

Target group:

Business and commerce, Scientists and scholars

Relevance:

transregional, national

Subject areas:

Electrical engineering, Information technology

Types of events:

Seminar / workshop / discussion

Entry:

12/08/2020

Sender/author:

Susann Thoma

Department:

Presse- und Öffentlichkeitsarbeit

Event is free:

yes

Language of the text:

English

URL of this event: http://idw-online.de/en/event67531

Attachment
attachment icon Grafische Darstellung einer Elektro-optischen Leiterplatte (EOCB).

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