Speaker: Markus Wöhrmann
New packaging technologies like Fan-Out Wafer or Panel Level Packaging are based on a broader mixture of different polymeric materails compared to fan-in WLP packages.
In such packages the performance of polymers plays a major role in the built-up structure because it is one of the key layers which act as a buffer between IC and PCB or molding compound.
In addition, the selection of the optimal polymer for a given application depends not only on its physical and chemical properties and processability, but also on its intrinsic interfacial characteristics. Therefore aside of the material properties of the polymer the interaction of the polymer layer with the substrate is important. The material mismatch causes for example warpage and material cracking; the main impact factor being the residual stress in the layers in relation to the fracture toughness of the material and the interface.
These different aspects will be discussed in this webinar together with measuerment techniques for detecting possible weak points.
Register here: https://www.izm.fraunhofer.de/en/news_events/trainings-and-workshops/advanced-pa...
Information on participating / attending:
The expert session series »Advanced Packaging: Simulation, Technology, and Reliability« will give you an exciting insight into hot R&D topics at Fraunhofer IZM and an idea about how you can use our research results and possibilities for your industry or for joint projects together with us.
Participation is free of charge, registration is required. This series aims to address our customers, partners and interested parties from industry, politics and science.
02/09/2021 16:00 - 02/09/2021 16:45
Business and commerce, Scientists and scholars
Types of events:
Seminar / workshop / discussion
Presse- und Öffentlichkeitsarbeit
Event is free:
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URL of this event: http://idw-online.de/en/event67772
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