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04/13/2021 - 04/13/2021 | Berlin

New trends in encapsulation technologies for SiP and power electronics

Encapsulation protects the sensitive wirebonds from environmental influences resulting in molded packages or glob top protected Chip-on-Boards (CoB). The session will give an insight into encapsulation technologies for advanced SiPs and power electronics.

Speaker: Karl-Friedrich Becker

Encapsulation, by tradition, has been used to protect the sensitive wirebonds from environmental influences resulting in molded packages or glob top protected Chip-on-Boards (CoB).

Underfiller based on filled polymers was the key process to broaden the application area of flip chip assembly to laminate substrates reducing reliability issues due to the large difference in the coefficient of thermal expansion. Capillary flow underfillers or new developments in no-flow materials are therefore essential to achieve high reliability under even critical operating conditions. This will be also the case for new advanced 3D Si stacking technologies in the future.

In this session, research integration technologies for SiP and power electronic products, focusing in particular on device assembly for highly integrated packages and encapsulation and coating processes based on polymeric materials, will be discussed.
A major focus will be put on encapsulation processes: from dispensing, jetting to film coating, through to transfer and compression molding. In addition, an overview of the materials, processes and device analyses will be given.

Register here: https://www.izm.fraunhofer.de/en/news_events/trainings-and-workshops/advanced-pa...

Information on participating / attending:
The expert session series »Advanced Packaging: Simulation, Technology, and Reliability« will give you an exciting insight into hot R&D topics at Fraunhofer IZM and an idea about how you can use our research results and possibilities for your industry or for joint projects together with us.

Participation is free of charge, registration is required. This workshop series aims to address our customers, partners and interested parties from industry, politics and science.

Date:

04/13/2021 16:00 - 04/13/2021 16:45

Event venue:

Online/ MS Teams
13355 Berlin
Berlin
Germany

Target group:

Business and commerce, Scientists and scholars

Relevance:

transregional, national

Subject areas:

Electrical engineering

Types of events:

Seminar / workshop / discussion

Entry:

03/31/2021

Sender/author:

Susann Thoma

Department:

Presse- und Öffentlichkeitsarbeit

Event is free:

yes

Language of the text:

English

URL of this event: http://idw-online.de/en/event68346

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attachment icon New Trends in Encapsulation Technologies for SiP and Power Electronics

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