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01/25/2022 - 01/25/2022 | Berlin

#1 Online-Session »Advanced flexible circuits for novel applications«

High density thin film flex - technology and applications

High density thin film flex technology can deliver solutions to gain lowes profiles and highes integration densities for advanced packaging scenarious. The expert session will give an overview of the processes and application examples of the newest generation of thin film flex technology.

Speaker: Kai Zoschke

Be part of our last lecture session on January 25, 2022: Within 45 minutes we would like to show you one presentation and afterwards our experts will be available in a deep dive for your questions and comments. Participation is free of charge, registration is required.

Register here:

The presentation provides a latest technology review for fabrication of high density thin film flex and related application examples. The fabrication approach utilizes the well-established processes from wafer level packaging and redistribution technology. All details regarding the different implementation options will be discussed in the presentation.

Furthermore, possible application fields of the high density thin film flex technology and related examples will be discussed in this presentation. In many cases, the ultra-thin profile of the flex circuits with the feature for hosting embedded ICs is of great benefit for different types of sensor applications. Based on that, senor systems with embedded ICs for vibration monitoring or RADAR detection were fabricated for industry 4.0 related use cases.

Flex circuits can also be used to enable the wearability of electronics for example in healthcare or smart clothing application. One example from the European project APPLAUSE will be presented.

Fraunhofer IZM stands for application-oriented, industry-oriented research.
With its technology clusters in the field of wafer and substrate process technology as well as its high competence in simulation and metrology, Fraunhofer IZM covers the entire range required for the realization of reliable electronics and their integration into applications. With our expert session series "Advanced flexible Circuits for novel Applications"we want to introduce you to the world of flexibles!

Interested in more?

The expert session series »Advanced flexible circuits for novel applications« frequently features hot research topics and IZM expert speakers. New sessions and dates will be frequently published on our website.

Information on participating / attending:
Participation is free of charge, registration is required.

Invitations are extended primarily to customers and partners, but also to interested parties from industry, politics, science and society.


01/25/2022 16:00 - 01/25/2022 16:45

Event venue:

Online I MS Teams
13355 Berlin

Target group:

Business and commerce, Scientists and scholars


transregional, national

Subject areas:

Electrical engineering, Information technology, Medicine

Types of events:

Seminar / workshop / discussion




Susann Thoma


Presse- und Öffentlichkeitsarbeit

Event is free:


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URL of this event:

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