There are various concepts for assembling power electronics. What all packaging concepts have in common is that high-quality and highly reliable metallic connections are required at many points. These include the die attach, the top-side chip contacts, the joints for load and control and the interconnections to the cooler. Soldering, silver sintering, wire bonding as well as laser and ultrasonic welding are technologies used for these interconnections. The presentation provides an overview of the state of the art as well as the challenges and solutions for these metallic connection technologies.
What to expect from our Experts Sessions
In our 45-minutes expert sessions we would like to present to you trending topics in a technical presentation. Afterwards, our experts will be available for your questions and comments and a joint discussion.
Next Dates & Topics:
12.3.: Novel Integration Concepts for Power Electronics – PCB Embedding for SiC and GaN Semiconductors (Lars Böttcher)
26.3.2024 Reliability Challenges of Power Electronic Modules (Dr. Stefan Wagner)
More information and registration (free of charge!) you can find on our website:
https://www.izm.fraunhofer.de/en/news_events/trainings-and-workshops/powering-th...
Information on participating / attending:
Participation is free of charge, registration is required. This workshop series aims to address our customers, partners and interested parties from industry, politics and science.
Date:
02/27/2024 16:00 - 02/27/2024 16:45
Event venue:
MS Teams I Online
13355 Berlin
Berlin
Germany
Target group:
Business and commerce, Scientists and scholars
Email address:
Relevance:
transregional, national
Subject areas:
Electrical engineering, Environment / ecology, Traffic / transport
Types of events:
Seminar / workshop / discussion
Entry:
02/13/2024
Sender/author:
Susann Thoma
Department:
Presse- und Öffentlichkeitsarbeit
Event is free:
no
Language of the text:
English
URL of this event: http://idw-online.de/en/event76231
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