idw – Informationsdienst Wissenschaft
Nachrichten, Termine, Experten
Nachrichten, Termine, Experten
Ultra-thin flexible glass (UTG) substrates with thicknesses lower than 100 µm show excellent surface- and barrier properties comparable to thick glass while being flexible. Therefore, a high potential of UTG is seen in electronical applications e. g. in displays, OLEDS or circuit carriers. Because of the existing challenges (especially the specific material properties like brittle fracture behavior) during handling and processing of UTG, at present, it is only used in special applications.
This talk will give an overview of the general fracture behavior of UTG. Further, challenges to a wide application of UTG are presented together with results from different research activities. In detail, process steps that influence the mechanical toughness of the UTG are discussed with focus on coating and separation methods. Different mechanical test methods are discussed regarding their comparability, advantages and disadvantages.
Information on participating / attending:
The expert session is part of our Materials Insights 23 | 24 series in which we introduce some of the latest highlights of our research focused on current and future needs in industry. Each session provides a 20 minute presentation from one of our experts and 20 minutes of discussion with the interested parties from industry and science.
Participation is free, registration is required.
Date:
03/13/2024 14:00 - 03/13/2024 14:45
Registration deadline:
03/13/2024
Event venue:
Online
06120 Online
Sachsen-Anhalt
Germany
Target group:
Scientists and scholars
Email address:
Relevance:
international
Subject areas:
Electrical engineering, Materials sciences
Types of events:
Presentation / colloquium / lecture, Seminar / workshop / discussion
Entry:
02/27/2024
Sender/author:
Susann Dohmhardt
Department:
Presse- und Öffentlichkeitsarbeit
Event is free:
no
Language of the text:
English
URL of this event: http://idw-online.de/en/event76359
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