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03/18/2025 - 03/18/2025 | Berlin

Towards washable E-Textiles: Influences on washing reliability for textile integrate

#2 session of our series »Electronic Solutions for Challenging Environments« // SPEAKER: Sigrid Rotzler

Washability is a necessity for most wearable electronic textiles (e-textiles), yet difficult to achieve. For textile circuits, the requirements are particularly high. The expert session will give an insight into how different material and processing parameters (from textile substrates and circuit types to integration and interconnections) and their interactions can impact washability.

Wearable electronic textiles (e‐textiles) can provide comfortable and unobtrusive solutions for a wide range of applications, but insufficient reliability can prevent a wider market success. Washability is a critical reliability concern, especially for textile integrated circuits that are permanently attached to the textile substrate. Due to the combined stresses during washing and drying procedures, achieving satisfactory washing reliability while trying to maintain the textile properties of the e-textile can be challenging.

Apart from the washing method itself, the washability of e-textiles is influenced by a wide range of parameters: the textile substrates and their properties, the type and specifics of the textile circuit, the integration method used to permanently fix the circuits to the textile as well as the interconnection of the circuits with other components of an e-textiles system.

The session will provide valuable insight into how and at which points textile integrated circuits need to be optimized to improve their washability. We will explore the interactions between textile properties, circuit types and assembling methods and the resulting influences on washing reliability. The session will provide strategies for the development of more robust and reliable e‐textiles that are able to withstand (domestic) washing procedures.
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In this series, we highlight innovative technologies for applications that are used in challenging conditions, be it in medical technology, in the oceanic environment, in the automotive sector or even in clothing. The aim of this series of lectures is to share expertise and discuss new approaches to successfully meeting the challenges of these special environments. Join us and learn how cutting-edge technologies and creative approaches are changing our world!

In our 45-minutes expert sessions we would like to present to you trending topics in a technical presentation. Afterwards, our experts will be available for your questions and comments and a joint discussion.

Fraunhofer IZM stands for application-oriented, industry-focused research. With its technology clusters in the field of wafer and substrate process technology as well as its high competence in simulation and metrology, Fraunhofer IZM covers the entire range required for the realization of reliable electronics and their integration into applications.

More dates:
01.04.25: Challenges for electronic assemblies in automotive applications
Dr. Stefan Wagner |
15.04.25: Next-Generation Neural Implants: Pathways to Longevity
Dr. Joshua Wilson |

Information on participating / attending:
Experts from various departments at our institute share their insights into the development, implementation and optimization of electronic systems that have to withstand e.g. extreme temperatures, humidity, friction, mechanical stress etc. or have to meet certain compatibility, health, safety or security standards.

Date:

03/18/2025 16:00 - 03/18/2025 16:45

Event venue:

MS Teams I Online
13355 Berlin
Berlin
Germany

Target group:

Business and commerce, Scientists and scholars

Relevance:

transregional, national

Subject areas:

Electrical engineering

Types of events:

Seminar / workshop / discussion

Entry:

03/06/2025

Sender/author:

Susann Thoma

Department:

Presse- und Öffentlichkeitsarbeit

Event is free:

yes

Language of the text:

English

URL of this event: http://idw-online.de/en/event78825

Attachment
attachment icon Promotion Session 2

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