idw – Informationsdienst Wissenschaft
Nachrichten, Termine, Experten
Nachrichten, Termine, Experten
idw - Informationsdienst
Wissenschaft
10/22/2024 - 12/03/2024 | Berlin
The great diversification of application scenarios leads to more highly integrated substrates in order to match a wide variety of requirements. Therefore, advanced substrates play a central role in the rapid development of the electronics industry – they make it possible to overcome the limitations of conventional printed circuit boards and create innovative solutions for complex challenges and mission profiles. Their relevance extends across various application areas and technologies that are shaping the future of electronics.
Advanced substrates offer a number of advantages that go far beyond the capabilities of traditional printed circuit boards (PCBs). With the capability to route more contacts and serve a larger number of I/Os due to improved materials and processes, they significantly increase the overall performance of electronic components and pave the way for our next generation products. Novel dielectrics with better RF performance, thinner laminate layers, high aspect ratio vias and the possibility to merge the electronic with the optical domain make it possible to design devices that are not only more powerful, but also smaller and lighter - a decisive advantage in miniaturization and performance.
However, the relevance of advanced substrates does not only extend to technical performance. Their development and application also contribute to better sustainability. Biogenous and biodegradeable materials as well as more resource-efficient manufacturing processes, they can help to reduce the ecological footprint of the electronics industry, enable the circular economy and allow for mass customization to build products specific to a use case.
Programme:
22.10.24: Fan-out Wafer and Panel Level Packaging – A versatile Platform for next Generation 2 and 2.5 D Packaging Solutions
Tanja Braun
05.11.24: High density Organic Substrates
Lars Böttcher
19.11.24: Integration of III-V RFICs in Antenna-in-Package modules in PCB-based embedding technology for 5G/6G Applications
Tekfouy Lim
3.12.24: Glass Core Substrates
Julian Schwietering, Ruben Kahle
Information on participating / attending:
Participation is free of charge, registration is required.
The expert session series aims to address our customers, partners and interested parties from industry, politics and science.
Date:
10/22/2024 16:00 - 12/03/2024 16:45
Event venue:
MS Teams
13355 Berlin
Berlin
Germany
Target group:
Business and commerce, Scientists and scholars
Email address:
Relevance:
international
Subject areas:
Electrical engineering
Types of events:
Seminar / workshop / discussion
Entry:
09/12/2024
Sender/author:
Susann Thoma
Department:
Presse- und Öffentlichkeitsarbeit
Event is free:
yes
Language of the text:
English
URL of this event: http://idw-online.de/en/event77673
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