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Image for: Konsortium zum Panel Level Packaging geht in die nächste Runde


Das zweite Konsortium zum Panel Level Packaging startet: Technologische Entwicklungen der industriell nutzbaren Prozesse zur Herstellung von Low-cost-Packages im Panel-Format sollen vertieft werden.
Das zweite Konsortium zum Panel Level Packaging startet: Technologische Entwicklungen der industriell nutzbaren Prozesse zur Herstellung von Low-cost-Packages im Panel-Format sollen vertieft werden.

© Fraunhofer IZM | Volker Mai

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