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10/06/2016 13:46

Fraunhofer HHI at micro photonics in Berlin, October 11-13, 2016

Anne Rommel Pressestelle
Fraunhofer-Institut für Nachrichtentechnik Heinrich-Hertz-Institut

    At this year's micro photonics, the Fraunhofer Heinrich Hertz Institute HHI presents its latest solutions in the area of photonic components.

    You find the following highlights at our Booth 207 in Hall 7.2C:

    InP Foundry Services – Photonic Integration Toolbox

    Fraunhofer HHI enables an own design of InP-based Photonic Integrated Circuit (PIC) containing passive and active devices on one substrate. It is possible to choose from a range of proven building blocks, such as 40 GHz receivers, 20 GHz transmitters, and 1 dB/cm passive waveguides. Low-cost multi-project-wafer-run-based PICs are already commercially available through Jeppix and customer-specific private runs can be realized on demand. Dedicated design and layout software is provided, and several packaging partners are available.

    InP Lasers for Integration into Silicon Photonics – Optical Sources for Si-Photonics

    Fraunhofer HHI provides DFB lasers, gain chips and SOAs with flip chip capability for hybrid integration on Si-Platforms. Single devices and arrays are offered for lateral and vertical coupling schemes. InGaAsP and InGaAlAs are used as active MQW layer and operating wavelengths range from 1270 nm to 1650 nm.

    PolyBoard Foundry Services

    The PolyBoard integration platform allows for rapid prototyping, short iteration cycles and low upfront development effort. Fraunhofer HHI's technology allows the integration of on-chip free space elements, 3D structures, graphene electro-absorption modulators, as well as other optical functionalities such as switches, variable optical attenuators, and tunable lasers.


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    Criteria of this press release:
    Journalists
    Electrical engineering, Information technology, Physics / astronomy
    transregional, national
    Research projects, Research results
    English


     

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