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Image for: EV Group und Fraunhofer IZM-ASSID bauen Partnerschaft beim Wafer-Bonden für Quantum Computing-Anwendungen aus


Mitarbeitende von EV Group und des Fraunhofer IZM-ASSID neben einem vollautomatischen EVG®850 DB UV-Laser-Debonding- und Reinigungssystem, installiert im neu eröffneten Center for Advanced CMOS and Heterointegration Saxony (CEASAX) in Dresden.
Mitarbeitende von EV Group und des Fraunhofer IZM-ASSID neben einem vollautomatischen EVG®850 DB UV-Laser-Debonding- und Reinigungssystem, installiert im neu eröffneten Center for Advanced CMOS and Heterointegration Saxony (CEASAX) in Dresden.

Silvia Wolf

© Fraunhofer IZM

(4489 KB, 5253 x 3495 pixels)

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